Integrated circuits. Three dimensional integrated circuits - Model and measurement conditions of through-silicon via Ingestion-build-68772 and product development

and product development

These processes can be supported by a solid material close to the breakdown point

monitors or analyses substances

Colloidal/self-assembly methods

Integrated circuits. Three dimensional integrated circuits - Model and measurement conditions of through-silicon via Ingestion-build-68772 and product developmentWhat is this standard about? This part of IEC 63011 specifies a reference model of through silicon via (TSV) electrical characteristics required for an interface design in three dimensional integrated circuit (3 D IC) to transmit and receive digital data and measurement conditions for resistance and capacitance to specify TSV characteristics in 3 D IC. 3 D IC specifications covered by this document are the following: application: digital consumer and