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G03700 - SEMI G37 - Specification for Dimensions and Tolerances Used to Manufacture Plastic Molded Small Outline Package Tooling Revision:Default Title SEMI E126-0305 (technical revision)
G03700 - SEMI G37 - Specification for Dimensions and Tolerances Used to Manufacture Plastic Molded Small Outline Package Tooling Revision:Default Title SEMI E126-0305 (technical revision)
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Description
SEMI E126-0305 (technical revision)
the user estimates all biases and variances associated with the equipment being compared under the specified operating conditions and with respect to the process characteristic(s) of interest
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SEMI MS2 — Test Method for Step Height Measurements of Thin Films
G03700 - SEMI G37 - Specification for Dimensions and Tolerances Used to Manufacture Plastic Molded Small Outline Package Tooling Revision:Default Title SEMI E126-0305 (technical revision)This document is a guideline for the ordering of tooling required to mold and form plastic molded small outline semiconductor packages. It is to be used by packaging engineers, mold manufacturers, and end of line toolmakers as the basis for defining the limits of manufacturing tolerances. Referenced SEMI Standards None.
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