Hollywood Jmmhlw 88 3205
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G09300 - SEMI G93 - ボール・グリッド・アレイ（BGA）パッケージ用はんだボールの測定方法 Revision:SEMI G93-0412 - Inactive timeliness
G09300 - SEMI G93 - ボール・グリッド・アレイ（BGA）パッケージ用はんだボールの測定方法 Revision:SEMI G93-0412 - Inactive timeliness
$115.50
Description
timeliness
SEMI A2 — Specification for Surface Mount Assembler Smart Hookup (SMASH)
1 These test methods are both in use within the industry
This edition was approved for publication by the global Audits and Reviews Subcommittee on November 29
G09300 - SEMI G93 - ボール・グリッド・アレイ（BGA）パッケージ用はんだボールの測定方法 Revision:SEMI G93-0412 - Inactive timelinessglobal Assembly & Packaging Technical Committee2012221global Audits and Reviews Subcommittee20124www. semiviews. org www. semi. org BGA Referenced SEMI Standards None.
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